ASE Technology Holding Co., Ltd
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions, as well as module-based solutions. It also provides advanced packages, such as flip-chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip-chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer level packaging; SESUB; and substrate interposer packages. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company offers develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, and warehousing management services; and manufactures computer assistance systems and related peripherals, electronic components, communication peripherals, telecommunications equipment, and motherboards. The company serves customers in communication, computing, and consumer electronics/industrial/automotive sectors. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan. Show More...
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Website http://www.aseglobal.com
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Sector Technology
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Industry Semiconductors
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Last Quote 9.38 USD
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Last Updated 30-05-2025
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External Links Yahoo Finance Morningstar Ratios
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Interest Coverage
The interest coverage ratio is a debt ratio and profitability ratio used to determine how easily a company can pay interest on its outstanding debt.
Reference: Investopedia -
2010-12 2011-12 2012-12 2013-12 2014-12 2015-12 2016-12 2017-12 2018-12 2019-12 TTM Earnings Per Share TWD 9.56 7.12 6.92 7.96 11.16 9.92 9.32 10.38 12.14 7.82 7.88 Dividends TWD 1.02 2.0 1.64 4.22 3.69 8.03 6.45 5.56 4.37 4.99 4.99 Payout Ratio % * 10.7 24.3 24.0 54.6 35.3 78.0 82.6 50.9 36.3 42.1 63.4 Shares Mil 1.9 1.925 1.892 1.937 2.055 2.063 4.142 2.092 2.126 2.131 2.135 Book Value Per Share * USD 1.63 1.7 1.98 1.99 2.1 2.29 2.32 2.9 3.04 3.11 3.18 Free Cash Flow Per Share * USD 0.05 0.11 -0.2 -0.010 0.25 0.07 0.39 0.36 0.15 0.14 Return on Assets % 9.91 6.35 5.57 5.78 7.17 5.73 5.91 6.32 5.84 3.13 3.45 Financial Leverage (Average) 2.35 2.21 2.25 2.36 2.26 2.36 2.31 1.93 2.65 2.79 2.81 Return on Equity % 22.9 14.47 12.43 13.33 16.52 13.25 13.8 13.31 13.46 8.51 9.2 Return on Invested Capital % 13.2 8.83 7.78 8.22 10.19 8.4 8.59 9.11 8.83 4.88 4.53 Interest Coverage 17.47 11.2 9.28 9.39 13.12 11.06 12.16 16.39 9.88 6.41 Current Ratio 1.43 1.35 1.16 1.3 1.41 1.28 1.33 1.34 1.27 1.31 1.25 Quick Ratio 0.99 0.85 0.73 0.92 0.99 0.86 0.88 1.0 0.95 0.98 0.88 Debt/Equity 0.59 0.5 0.41 0.41 0.38 0.43 0.48 0.23 0.72 0.89 0.8